Item |
Technical Parameters |
Specification |
Min. Line Width (mil) |
3 |
Finished product Copper thickness 0.5 OZ |
Min. Space (mil) |
3 |
Finished product Copper thickness 0.5 OZ |
Min. Annular Ring Width
(mil) |
VIAS: 3mils |
Remained ring width means the distance between the hole edge
to the ring outskirt |
Component Holes : 5mils |
Min. Hole Size |
Board Thickness< 2.0mm |
0.2mm |
Finished product |
| Board Thickness< 1.2mm |
0.1mm |
Finished product |
Board Thickness
≥ 2.0mm |
Aspect Ratio
≤ 10 |
Finished product |
Max. Board Thickness |
Single and Double Side |
8.0mm |
1 |
Multilayer |
8.0mm |
Min. Board Thickness |
Single and Double Side |
0.2mm |
Multilayer |
4 layers: 0.4mm; 6 layers: 0.6mm;
8 layers: 1.0mm; 10 layers: 1.2mm |
Max. Board Size |
Single and Double Side |
609 x 609mm |
Multilayer |
550 x 810mm |
Distance between
Line to Board edge |
Outline: 0.20mm |
V-CUT: 0.4mm
V-CUT: 0.33mm( Board Thickness< 1.2mm) |
Max. Layers |
30 layers |
Solder |
Mask Window (mil) |
2/4 |
1. Single side; 2.
2mil is allowed for mask bridge or avoiding exposed lines.
|
Mask Bridge (mil) |
6 |
Between IC pins |
Color |
White, Black, Blue, Green, Yellow, Red, etc. |
1 |
Legend |
Min. Line Width (mil) |
5/8 |
Color |
White, Yellow, Black, etc. |
Surface Plating |
HAL,
Plated
Ni/Au, Immersion Ni/Au, etc. |
Plating Thickness (microinch) |
Techniques |
Plating Type |
Min. Thickness |
Max. Thickness |
Plated Ni/Au |
Ni Thickness |
100 |
150 |
Au Thickness |
1 |
3 |
Immersion Ni/Au |
Ni Thickness |
100 |
150 |
Au Thickness |
1 |
3 |
Gold Finger |
Ni Thickness |
120 |
150 |
Au Thickness |
5 |
30 |
Copper Plating Hole (micron) |
Copper Thickness |
20 |
25 |
Base Copper
Thickness |
Inner layers and Outer layers (oz) |
0.5 |
6 |
Finished Copper Thickness |
Outer Layers |
1 |
6.5 |
Inner Layers |
0.5 |
6 |
Insulation Layer (mm) |
0.06 |
---- |
Line Width/Space (mil) |
Max. Copper Thickness |
4/4; 4/5; |
0.5 oz |
Line width shouldn’t be less than the required value under ensure of space. |
4/6; 5/5; 6/5 |
1 oz |
5/6; 6/6 |
2 oz |
6/8; 7/8; 8/8 |
3 oz |
8/10; 9/10; 10/10 |
5 oz |
Board Materials |
FR-4; Aluminium Base; High Frequency; PTFE; FPC; Thick Copper; Paper Base; BT Base; Pi Base; Rogers4003 (PPC: 4403); PTFE+Al |
1 |
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