|
Description |
Current status |
2008 |
2009 |
Max. Layers |
28L |
32L |
35L |
LW/LS |
Inner layer |
75/75um |
75/75um |
75/75um |
Ourter layer |
100/75um |
100/75um |
75/75um |
Min. Mechanical drilling |
100 um |
80 um |
50 um |
Aspect ratio |
12.5:1 |
12.5:1 |
15:1 |
Copper Thickness |
8 oz |
8 oz |
8 oz |
Impedance Control |
¡À10% |
¡À8% |
¡À5% |
|
High frequency
/Microwave
|
SV |
SV |
SV |
Halogen-free |
SV |
SV |
SV |
Lead free |
SV |
SV |
SV |
Mix-material |
P |
P |
SV |
Metal based/core |
P |
P |
SV |
High Tg |
SV |
SV |
SV |
HDI |
1+C+1 |
P |
P |
SV |
Rigid-flex |
14 layers |
P |
P |
SV |
Buried Resistor/Capacitor |
P |
P |
SV |
Surface Technique |
OSP,Immersion gold,Selective gold plating,Immersin tin,HAL,Lead free HAL,Immersion silver |
SMT/PCBA |
Size:50*50-510*460mm,PCB Thickness 0.4-3mm,Min. SMD package:0201 |
PCB Layout Design |
High-speed multilayers PCB layout design for network,telecommunicati-ons,etc. |
| P:Prototype£» SV:Small volume |
|
Order Manage
